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ERIC Number: EJ1113017
Record Type: Journal
Publication Date: 2016
Pages: 22
Abstractor: As Provided
ISBN: N/A
ISSN: ISSN-0950-0693
EISSN: N/A
Understanding Metallic Bonding: Structure, Process and Interaction by Rasch Analysis
Cheng, Maurice M. W.; Oon, Pey-Tee
International Journal of Science Education, v38 n12 p1923-1944 2016
This paper reports the results of a survey of 3006 Year 10-12 students on their understandings of metallic bonding. The instrument was developed based on Chi's ontological categories of scientific concepts and students' understanding of metallic bonding as reported in the literature. The instrument has two parts. Part one probed into students' understanding of metallic bonding as (a) a submicro "structure" of metals, (b) a "process" in which individual metal atoms lose their outermost shell electrons to form a "sea of electrons" and octet metal cations or (c) an all-directional electrostatic force between delocalized electrons and metal cations, that is, an "interaction." Part two assessed students' explanation of malleability of metals, for example (a) as a submicro structural rearrangement of metal atoms/cations or (b) based on all-directional electrostatic force. The instrument was validated by the Rasch Model. Psychometric assessment showed that the instrument possessed reasonably good properties of measurement. Results revealed that it was reliable and valid for measuring students' understanding of metallic bonding. Analysis revealed that the "structure," "process" and "interaction" understandings were unidimensional and in an increasing order of difficulty. Implications for the teaching of metallic bonding, particular through the use of diagrams, critiques and model-based learning, are discussed.
Routledge. Available from: Taylor & Francis, Ltd. 325 Chestnut Street Suite 800, Philadelphia, PA 19106. Tel: 800-354-1420; Fax: 215-625-2940; Web site: http://www.tandf.co.uk/journals
Publication Type: Journal Articles; Reports - Research
Education Level: Secondary Education
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: N/A
Identifiers - Location: Hong Kong
Grant or Contract Numbers: N/A