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ERIC Number: EJ1048080
Record Type: Journal
Publication Date: 2014-Oct
Pages: 6
Abstractor: ERIC
ISBN: N/A
ISSN: ISSN-2158-0502
EISSN: N/A
Designing under Constraints: Cell Phone Case Design Challenge
Sutton, Kevin; Grubbs, Michael E.; Ernst, Jeremy
Technology and Engineering Teacher, v74 n2 p12-17 Oct 2014
Engineering design has been suggested as a viable instructional approach for Technology Education (TE) to intentionally provide students the opportunity to apply multidisciplinary concepts to solve ill-defined design challenges (Wells & Ernst, 2012; Sanders & Wells, 2010; Wicklein, 2006). Currently, the context for design challenges in TE typically relate to modern technology (Grubbs, 2013) or societal needs (Love & Strimel, 2012). However, as technology advances exponentially, one issue for technology educators is consistently conceptualizing design challenges that prepare students to use new technologies while providing relevance and interest. Three-dimensional (3D) printing provides an entry point for teaching engineering concepts, such as design and optimization, while also affording opportunities for learning science, technology, engineering, and mathematics (STEM) concepts (Bull, 2014). Fused deposition modeling (FDM) printers, in particular, allow TE students to turn virtual models of innovative products into physical prototypes. Thus, students can produce and evaluate their model, make modifications to their existing digital concept, and rapidly reprint a refined prototype. This technological advancement, alongside the inclusion of design within other STEM disciplines, presents a strong rationale and vehicle for addressing design in TE.
International Technology and Engineering Educators Association. 1914 Association Drive Suite 201, Reston, VA 20191-1539. Tel: 703-860-2100; Fax: 703-860-0353; e-mail: itea@iteaconnect.org; Web site: http://www.iteaconnect.org
Publication Type: Journal Articles; Reports - Descriptive
Education Level: Higher Education; Postsecondary Education
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: N/A
Grant or Contract Numbers: N/A