ERIC Number: EJ925543
Record Type: Journal
Publication Date: 2011-May
Pages: 9
Abstractor: As Provided
ISBN: N/A
ISSN: ISSN-0018-9359
EISSN: N/A
Vertical Integration of System-on-Chip Concepts in the Digital Design Curriculum
Tang, Ying; Head, L. M.; Ramachandran, R. P.; Chatman, L. M.
IEEE Transactions on Education, v54 n2 p188-196 May 2011
The rapid evolution of System-on-Chip (SoC) challenges academic curricula to keep pace with multidisciplinary/interdisciplinary system thinking. This paper presents a curricular prototype that cuts across artificial course boundaries and provides a meaningful exploration of diverse facets of SoC design. Specifically, experimental contents of a digital flow SoC product design--a simplified Transmission Control Protocol (TCP)/Internet Protocol (IP) stack--are systematically developed and implemented in the series of courses that comprise the Digital Design track of the Rowan Electrical and Computer Engineering (ECE) curriculum. The System-on-Chip project and its progressively more complex laboratory modules are described and discussed. Its implementation in the existing ECE curriculum is also presented along with the assessment results. (Contains 9 tables and 4 figures.)
Descriptors: Curriculum Development, Design, Electronics, Systems Approach, Computers, Comparative Analysis, Internet, Interdisciplinary Approach, Engineering Education, Curriculum Implementation, Curriculum Evaluation, Undergraduate Study, Laboratories, College Instruction, Computer Science Education, Computer Software, Computer System Design, Programming, Information Technology, College Students, Student Surveys, Instructional Effectiveness, Evaluation Methods
Institute of Electrical and Electronics Engineers, Inc. 445 Hoes Lane, Piscataway, NJ 08854. Tel: 732-981-0060; Web site: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=13
Publication Type: Journal Articles; Reports - Descriptive
Education Level: Higher Education; Postsecondary Education
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: N/A
Identifiers - Location: New Jersey
Grant or Contract Numbers: N/A