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ERIC Number: EJ920716
Record Type: Journal
Publication Date: 2010-Oct
Pages: 37
Abstractor: As Provided
Reference Count: 56
ISSN: ISSN-1059-7069
Use of Innovation Component Configuration Map (ICCM) to Measure Technology Integration Practices of Higher Education Faculty
Javeri, Manisha; Persichitte, Kay
Journal of Technology and Teacher Education, v18 n4 p607-643 Oct 2010
The purpose of this study was to investigate the relationship between the level of technology integration fidelity (high, moderate or low) by higher education faculty in Schools Colleges and Department of Education (SCDE), and a) access to technological infrastructure, b) support from human infrastructure, and c) personal attitude toward computer use. The primary instrument used in this study was a custom-develop Innovation Component Configuration Map (ICCM) that measured technology integration practices. Significant findings of the study are: (a) on an average 56.7 % of the SCDE faculty parallel best practices in technology integration, (b) 56.7 % of the faculty were classified high fidelity, 38 % moderate fidelity and 5.3 % low fidelity integrators of technology, and (c) Multinomial logistic regression analysis showed that "positive reactions to computers" and "comfort with familiar computer-related mechanisms" were the only significant contributors to explaining the difference between high and low fidelity groups. "Comfort with familiar computer-related mechanisms" was the only significant contributor to differences in the moderate and high fidelity groups. The results of the ANOVA indicated significant difference between faculty who reported adequate and faculty who reported inadequate technological infrastructure. Faculty with high computer anxiety when received adequate support from human infrastructure improved on their technology integration skills. (Contains 3 figures and 4 tables.)
Association for the Advancement of Computing in Education. P.O. Box 1545, Chesapeake, VA 23327-1545. Tel: 757-366-5606; Fax: 703-997-8760; e-mail:; Web site:
Publication Type: Journal Articles; Reports - Research
Education Level: Higher Education; Postsecondary Education
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: N/A