NotesFAQContact Us
Collection
Advanced
Search Tips
Peer reviewed Peer reviewed
ERIC Number: EJ695911
Record Type: Journal
Publication Date: 2005-Mar-1
Pages: 23
Abstractor: Author
Reference Count: N/A
ISBN: N/A
ISSN: ISSN-0303-8300
Relations between Social Problem Solving and Indicators of Interpersonal and Family Well-Being among Chinese Adolescents in Hong Kong
Siu, Andrew M. H.; Shek, Daniel T. L.
Social Indicators Research, v71 n1-3 p517-539 Mar 2005
This study evaluated the dimensionality of the construct of social problem solving and examined the relationships between social problem solving and empathy, emotional well-being and family well-being in a sample of secondary school students in Hong Kong (N = 1462). The participants completed measures of social problem solving (the 25-item short form of the Chinese version of the Social Problem-Solving Inventory: C-SPSI-R), empathy (the Chinese Interpersonal Reactivity Scale), emotional well-being (the Chinese Vengeance Scale) and family well-being (the Chinese Family Assessment Instrument and the Conflict Behaviour Questionnaire). Regarding the dimensionality of the C-SPSI, confirmatory factor analysis showed that the scale has a stable five-factor structure (RMSEA = 0.05) and that the related subscales were reliable (with ranging from 0.65 to 0.81). Participants with higher levels of social problem solving had higher levels of empathy and lower personal distress in applying empathy, which suggested that these personal competencies were inter-related. Higher levels of social problem solving were also related to better emotional well-being (less tendency to take revenge) and better family quality of life (better family functioning and fewer parent-adolescent conflicts).
Springer-Verlag New York, LLC., Journal Fulfillment, P.O. Box 2485, Secaucus, NJ 07096. Tel: 800-777-4643 (Toll Free); Fax: 201-348-4505; Web site: http://www.springeronline.com
Publication Type: Journal Articles; Reports - Research
Education Level: N/A
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: N/A
Identifiers - Location: Hong Kong