ERIC Number: EJ1279628
Record Type: Journal
Publication Date: 2020
Pages: 14
Abstractor: As Provided
ISBN: N/A
ISSN: ISSN-2168-3603
EISSN: N/A
Available Date: N/A
Developing a School Attendance Reason Scale and Its Relationship with Chinese Students' School Adjustment
Wang, Yansong; Shoji, Ichiko
International Journal of School & Educational Psychology, v8 suppl 1 p146-159 2020
This study aimed to validate the Chinese School Attendance Reason Scale (CSARS) for assessing junior high students' reasons for school attendance and examine the relationship between school attendance and school adjustment among Chinese students. Participants included three independent samples of 1,235 students from four Chinese provinces. Exploratory and confirmatory factor analyses indicated a four-factor scale: external pressure, norm, school attractiveness, and habit. The CSARS' measurement invariance was generally supported, and test-retest reliability and predictive validity were examined. A multiple regression analysis was also conducted with each school attendance subscale as an independent variable, and school adjustment as the dependent variable. Since external pressure and school attractiveness strongly influence school adjustment, school support services should address these variables.
Descriptors: Test Construction, Test Validity, Test Reliability, Attendance, Student Adjustment, Student School Relationship, Negative Attitudes, Junior High School Students, Early Adolescents, Parent Influence, Teacher Influence, Behavior Standards, Social Behavior, Peer Relationship, Habit Formation, Gender Differences, Instructional Program Divisions, Foreign Countries, Cultural Background
Routledge. Available from: Taylor & Francis, Ltd. 530 Walnut Street Suite 850, Philadelphia, PA 19106. Tel: 800-354-1420; Tel: 215-625-8900; Fax: 215-207-0050; Web site: http://www.tandf.co.uk/journals
Publication Type: Journal Articles; Reports - Research
Education Level: Junior High Schools; Middle Schools; Secondary Education
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: N/A
Identifiers - Location: China (Shanghai)
Grant or Contract Numbers: N/A
Author Affiliations: N/A

Peer reviewed
Direct link
