NotesFAQContact Us
Search Tips
Peer reviewed Peer reviewed
Direct linkDirect link
ERIC Number: EJ1237009
Record Type: Journal
Publication Date: 2019-Dec
Pages: 19
Abstractor: As Provided
ISSN: ISSN-0018-1560
The Interplay between Ethnic and Academic Identity Construction among South Asian Students in Hong Kong Tertiary Education
Gu, Mingyue Michelle; Guo, Xiaoyan Grace; Lee, John Chi-Kin
Higher Education: The International Journal of Higher Education Research, v78 n6 p1109-1127 Dec 2019
This qualitative study investigates the interplay between the ethnic and academic identity construction of a group of university students with South Asian backgrounds in Hong Kong. The findings indicate that ethnic identity and ethnic socialization have protective and facilitative effects on learning motivation and academic achievement. It is found that these ethnic minority students receiving tertiary education, holding congruent views of ethnic and academic identity, display a sense of agency and critical reflectivity of both the host society and their heritage communities and see facilitating community uplift and developing a more positive social image of ethnic minorities as their generation's responsibility. Reconstructing an ethnic identity and developing new social images therefore motivate them to pursue academic success. The findings indicate that the South Asian students figured out ways in which to interact with the outer world and set up new roles and spaces (i.e., a heritage community with more positive social image). The findings shed light on how to provide better opportunities for and assistance to ethnic minority students when they pursue higher education.
Springer. Available from: Springer Nature. 233 Spring Street, New York, NY 10013. Tel: 800-777-4643; Tel: 212-460-1500; Fax: 212-348-4505; e-mail:; Web site:
Publication Type: Journal Articles; Reports - Research
Education Level: Higher Education; Postsecondary Education
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: N/A
Identifiers - Location: Hong Kong
Grant or Contract Numbers: N/A