ERIC Number: ED541389
Record Type: Non-Journal
Publication Date: 2007-Oct
Reference Count: 0
Targeting Undergraduate Students for Surveys: Lessons from the Academic Pathways of People Learning Engineering Survey (APPLES). Research Brief
Donaldson, Krista M.; Chen, Helen L.; Toye, George; Sheppard, Sheri D.
Center for the Advancement of Engineering Education (NJ1)
The Academic Pathways of People Learning Engineering Survey (APPLES or APPLE survey) is a component of the Academic Pathways Study (APS) of the Center for the Advancement of Engineering Education (CAEE). The APS aims to provide a comprehensive account of how people become engineers by exploring key questions around the engineering learning experience. The goal of the APPLE survey is to validate the longitudinal data from the APS Persistence in Engineering (PIE) survey, as well as findings from other APS data collection methods. Despite the Team's experience with the PIE survey deployment during 2004-2007 and comprehensive planning, many lessons were learned in the design and administration of the APPLE survey: (1) Start the Internal Review Board (IRB) process at least four months prior to the planned deployment; (2) Consider the different stakeholders when determining the incentive for participation; (3) Allocate resources for comprehensive piloting of the survey; (4) Emphasize sharing and learning from other recruitment plans across institutions; (5) Add survey items to weed out ineligible subjects; and (6) Allow multiple submissions from a single IP address.
Descriptors: Engineering Education, Engineering, Learning Experience, Undergraduate Students, Student Surveys, Program Validation, Psychometrics, Formative Evaluation, Evaluation Methods, Educational Research
Center for the Advancement of Engineering Education. Available from: University of Washington. Box 352183, Seattle, WA 98195. Fax: 206-221-3161; e-mail: celtad@engr. washington.edu; Web site: http://www.engr.washington.edu/caee
Publication Type: Reports - Research
Education Level: Higher Education
Sponsor: National Science Foundation
Authoring Institution: University of Washington, Center for the Advancement of Engineering Education (CAEE)