ERIC Number: ED477408
Record Type: RIE
Publication Date: 2001
Reference Count: N/A
College: You Can Do It! How Students with Disabilities Can Prepare for College.
Washington Univ., Seattle.
This guide for high school students with disabilities addresses issues surrounding transition from high school to college and beyond. It notes that these transitions include three phases: (1) preparing for college, including preparations that occur in high schools; (2) staying in college, which requires numerous self-management skills; and (3) preparing for moving beyond college to a career. Planning suggestions are then given for meeting entrance requirements, maintaining good high school grades, utilizing any needed accommodations when taking pre-college examinations, completing college applications, finding financial aid, knowing what support services are needed, and attending college orientation sessions. Suggestions for the college experience focus on self-advocacy skills, self-management skills, study skills, use of support services, technology, and networking. Finally, suggestions for thinking ahead to a career cover academic and career choices, building a resume, and internships. A final section urges students to enjoy their college experience. Helpful hints and some suggested resources complete the publication. (DB)
Descriptors: Ancillary School Services, Career Education, College Admission, College Applicants, College Bound Students, College Choice, College Preparation, Disabilities, High Schools, Postsecondary Education, Secondary Education, Self Management, Student Personnel Services, Transitional Programs
DO-IT, Disabilities, Opportunities, Interworking & Technology, University of Washington, Box 355670, Seattle, WA 98195-5670. Tel: 206-685-DOIT (Voice/TTY); Fax: 206-221-4171; e-mail: firstname.lastname@example.org. For full text: http://www.washington.edu/doit.
Publication Type: Guides - Non-Classroom
Education Level: N/A
Sponsor: Department of Education, Washington, DC.; National Science Foundation, Arlington, VA.
Authoring Institution: Washington Univ., Seattle.
Note: Support also provided by the State of Washington, Seattle, WA.