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ERIC Number: ED423943
Record Type: Non-Journal
Publication Date: 1998-Nov
Pages: 69
Abstractor: N/A
Reference Count: N/A
Follow-Up Study of Fiscal Year 1997 Occupational Program Graduates, 1998.
Illinois Community Coll. Board, Springfield.
This report provides information from graduates of selected occupational programs regarding the effectiveness of their Illinois community college experience. The study surveyed a pool of 2,190 occupational program graduates, which yielded a usable response rate of 58.6%. The majority of graduate respondents (64.5%) came from programs in four primary areas: accounting; precision metal work; heating, air conditioning and refrigeration mechanics and repair; and mechanical engineering-related technologies. Part 1 consists of a statewide analysis of graduate pay rates, unemployment, additional education, and satisfaction with college service, program, and current position. Part 2 provides a program-specific analysis, outlining the following vocations: funeral services and mortuary science; quality control technology; mechanical engineering-related technologies; computer-aided design; home furnishings and equipment installation; library assistance; heating, air conditioning and refrigeration mechanics and repair; drafting, graphics and printing; precision metal work; machine technology; design and applied art; visual communications; medical lab technicians; ophthalmic medicine; accounting; and banking. The Summary and Policy Implications section discusses the following results: (1) unemployment was 5.2%; (2) job satisfaction increased from the 1992 survey; (3) employment percentages increased from the 1992 survey; (4) compared with the 1992 survey, there was greater satisfaction with major program components; and (5) graduates scored college higher than on the 1992 survey. Appended are overview tables for selected occupational programs. (Contains 10 references.) (AS)
Publication Type: Numerical/Quantitative Data; Reports - Research
Education Level: N/A
Audience: N/A
Language: English
Sponsor: N/A
Authoring Institution: Illinois Community Coll. Board, Springfield.