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ERIC Number: ED295719
Record Type: RIE
Publication Date: 1988
Pages: 38
Abstractor: N/A
Reference Count: N/A
ISBN: N/A
ISSN: N/A
Follow-Up Study of the Recipients of the Trustee Scholarship, 1974-1985. Volume XVI, No. 6.
Lucas, John A.
A follow-up study was conducted at William Rainey Harper College (WRHC) to assess post-graduation experiences of students who received a Trustee Scholarship award between 1974 and 1985 and to determine the impact of the award on students' lives. Surveys were sent to 172 former Trustee Scholarship recipients, requesting information on current employment and educational status, present educational goals, grade point average (GPA), relationship of WRHC major to transfer major or employment, salary, and perceptions of their WRHC experiences. Study findings, based on a 65% response rate, included the following: (1) 67% of the former Trustee Scholarship recipients were currently employed full time, with 52% working in fields closely related to their WRHC major; (2) 14% were enrolled in college full-time, 15% planned to return to college within the next year, and 21% planned to return to college at some time; (3) since leaving WRHC, 80% had attended another college, and 57% had obtained a bachelor's or higher degree; (4) 86% were employed as beginning or experienced professionals, earning an average annual salary of $23,500; (5) though most respondents indicated that they had received little help from WRHC in developing their managerial skills, 69% indicated that they supervised the work of other people in their jobs; and (6) over half of the respondents indicated that the Trustee Scholarship had allowed them to save money to further their education, 25% said it permitted them to work fewer hours while attending WRHC, and 20% indicated that they could not have attended WRHC without the award. Detailed study findings and the survey instrument are appended. (EJV)
Publication Type: Reports - Research; Tests/Questionnaires
Education Level: N/A
Audience: Administrators; Practitioners
Language: English
Sponsor: N/A
Authoring Institution: William Rainey Harper Coll., Palatine, IL. Office of Planning and Research.