Intellectual goods can follow the same pattern as physical goods with the product life cycle of birth, growth, maturity, and decline. For the intellectual good of technological, pedagogical, and content knowledge (TPACK), its birth began with Shulman (1986, 1987). Canonical correlation analysis (CCA) was used to test the relationships among five of the 12 constructs in the technology integration education (TIE) model developed by Holland and Piper (2014). Based on the patterns of cross-loading correlations, this study found that there were limited correlational relationships between the set of independent variables and the set of dependent TPACK variables. For this pilot study, the sample consisted of 90 elementary education majors and 51 secondary education majors.