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ERIC Number: ED370660
Record Type: RIE
Publication Date: 1994
Pages: 91
Abstractor: N/A
Reference Count: 0
ISBN: ISBN-0-87117-279-8
The Tech Prep Associate Degree Challenge: A Report of the Tech Prep Roundtable. AACC Special Reports No. 6.
Falcone, Lisa, Ed.; Mundhenk, Robert, Ed.
In fall 1993, a roundtable was held with leading Tech Prep practitioners to discuss the direction Tech Prep has taken since 1990 and emerging issues related to the implementation of Tech Prep Associate Degree (TPAD) programs. Stemming from the roundtable, this monograph describes Tech Prep, provides recommendations for implementation, and reproduces six papers presented at the meeting. The first three sections provide introductory materials and a list of roundtable participants. Part IV reviews the history of the TPAD from the early 1980's and offers 19 recommendations for implementing TPAD programs. Part V presents the following papers by roundtable participants: (1) "Tech Prep: So Much Promise, So Much Work," by Gerald C. Hayward, highlighting essential components of Tech Prep; (2) "Tech Prep Education: A U.S. Innovation Linking High Schools and Community Colleges," by Winifred I. Warnat, discussing Vocational-Technical Education enterprises, tech-prep models, and the influence of legislation; (3) "The Tech Prep Associate Degree Program Revisited," by Dale Parnell, addressing the cost effectiveness of TPAD programs; (4) "Tech Prep: A Practitioner's Perspective," by Diana Walter and Anita Turlington, outlining Tech Prep implementation in schools and outcomes assessment; (5) "Tech Prep: A Business Perspective," by Carver C. Gayton, describing the Boeing Company's involvement with TPAD programs; and (6) "The Future Role of Two-Year Colleges in Improving the School-to-Work Transition," by Richard Kazis, reviewing incentives and disincentives for community college commitment. (Contains 60 references.) (KP)
AACC Publications, P.O. Box 311, Annapolis Junction, MD 20701 ($13; $10/members).
Publication Type: Collected Works - Proceedings; Opinion Papers
Education Level: N/A
Audience: N/A
Language: English
Sponsor: Boeing Co., Seattle, WA.
Authoring Institution: American Association of Community Colleges, Washington, DC.
Identifiers: 2 Plus 2 Tech Prep Associate Degrees